Hua Hong Semiconductor Announces Mass Production of 90nm BCD Process: High Performance, Small Core Area

June 5 – Hua Hong Semiconductor has announced that it has achieved mass production of its 90nm BCD process on its 12-inch production line in Wuxi, China, which offers the advantages of high performance and a small core area, according to JCNnewswire.

Hua Hong Semiconductor Announces Mass Production of 90nm BCD Process: High Performance, Small Core Area

Hua Hong Semiconductor said its 90nm BCD process offers better electrical parameters and benefits from the stability of the 12-inch process as well as excellent yields, providing a more competitive manufacturing solution for chip applications such as digital power supplies and digital audio amplifiers.

Fan Heng, Executive Vice President of Hua Hong Semiconductor, said, “The increasing variety of intelligent hardware and application scenarios continues to increase the demand for power management chips, and the performance requirements for power management chips are also increasing.” Hua Hong Semiconductor’s 90nm BCD process is favored by many customers for its high performance indicators and small chip area and other quality features.

IT House learned that BCD (Bipolar-CMOS-DMOS) technology is a monolithic integration process technology that enables the production of Bipolar, CMOS and DMOS devices on the same chip, and was first developed successfully by STMicroelectronics in 1985. With the further development of IC process, BCD process has become the mainstream manufacturing technology for PICs.

Hua Hong Semiconductor Announces Mass Production of 90nm BCD Process: High Performance, Small Core Area

Hua Hong Semiconductor is a global leader in specialty process pure-play foundry, focusing on specialty process platforms for embedded non-volatile memory, power devices, analog and power management, and logic and RF.

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